Expert and reliable surface mount technology end-to-end PCB assembly services from Altimex.
What is Surface Mount Technology?
Surface Mount Technology (SMT) is a method of mounting electronic components directly onto the surface of printed circuit boards (PCBs), rather than inserting leads through drilled holes.
At Altimex, with decades of PCB expertise, we use SMT for its precision, efficiency, and high-density assembly capability. Components such as resistors, capacitors, and ICs are placed using automated pick-and-place machines and soldered via reflow ovens, ensuring strong electrical and mechanical connections. SMT allows for smaller, lighter, and faster PCBs, supports multi-layer designs, and improves signal integrity.
Our Mixed Technology PCB Assembly Capabilities
Altimex combines surface mount and through-hole assembly processes to manufacture PCB assemblies containing a wide range of component types. Each stage is planned around the board layout, component requirements and expected production volume, supporting accurate assembly from prototypes through to repeat production.
Altimex uses automated surface mount assembly equipment for the accurate placement of compact and fine-pitch components. Controlled solder paste application, component placement and reflow soldering support consistent results across prototypes, low-volume batches and repeat production.
Through-hole components are inserted and soldered using controlled manual or automated processes. This method is suited to connectors, transformers, larger components and parts that require strong mechanical connections or additional support.
Surface mount and through-hole components are assembled on the same PCB using a planned production sequence. Our engineers review component placement, soldering requirements and thermal considerations to reduce manufacturing risks and maintain consistent assembly quality.
Mixed technology PCB assemblies are inspected throughout production using visual checks, automated inspection and testing options based on the project requirements. Work is completed in line with IPC-A-610 and IPC-J-STD-001 standards.
End-to-End Surface Mount Technology PCB Assembly
End-to-end surface mount technology (SMT) PCB assembly at Altimex ensures a high-quality production process from design to finished board. Using IPC standards, we begin with precise solder paste application, followed by automated component placement using state-of-the-art pick-and-place machines.
Reflow soldering guarantees reliable electrical and mechanical connections, while comprehensive inspection and functional testing confirm full performance compliance. Our approach supports complex, high-density, and multi-layer PCB designs, maintaining strict quality standards at every stage.
Why Work With Altimex?
30+ Years Of Experience
Fast Turnaround Time
Tailored
Solutions
Building Long-Term Partnerships
Certified & Experienced Team
Sectors we support.
Electronics manufacturing for applications where quality, reliability and consistent performance matter.
Get In Touch Today For Surface Mount PCB Technology
If you have a query about our services or feel like we could help you, please get in touch by filling the form out below or by calling us on 01829 741 262.
Frequently Asked Questions
Surface Mount Technology is a method of mounting electronic components directly onto the surface of a PCB rather than inserting leads through holes. Unlike through-hole assembly, SMT allows for smaller, lighter, and higher-density boards. It supports multi-layer designs and improves electrical performance due to shorter interconnections. SMT is typically more suitable for automated, high-volume production, offering faster assembly times and greater precision. Through-hole may still be used for components requiring strong mechanical support, but SMT has become the standard for modern electronics due to its efficiency and compatibility with miniaturised designs.
SMT can accommodate a wide variety of components, including resistors, capacitors, diodes, transistors, integrated circuits, LEDs, and connectors specifically designed for surface mounting. These components are usually smaller than their through-hole equivalents and are supplied in reels or trays suitable for automated placement.
SMT supports both passive and active components and can handle fine-pitch ICs and complex packages such as QFP, BGA, and CSP. At Altimex, we ensure that all components are carefully selected for compatibility with automated placement and reflow soldering, which guarantees reliable electrical and mechanical connections across high-density PCBs while maintaining production efficiency.
Yes, SMT is particularly suited to multi-layer and high-density PCBs. Because components are mounted directly on the surface, both sides of the board can be utilised, maximising space and allowing complex routing. SMT supports fine-pitch ICs and micro components, which are essential for modern electronics such as smartphones, medical devices, and industrial controllers.
Automated placement ensures precision even with densely packed components, while reflow soldering guarantees reliable connections. At Altimex, our SMT process accommodates multi-layer boards of various thicknesses and complexities, ensuring high yields and performance compliance. This capability allows companies to develop compact, feature-rich devices efficiently.
Quality and reliability in SMT assembly are achieved through strict process control and comprehensive inspection. We use precise solder paste application, automated pick-and-place machines, and controlled reflow soldering profiles to maintain consistent connections. Each PCB undergoes AOI to detect misaligned components, missing parts, or solder defects. For complex components, X-ray inspection can be performed to verify hidden solder joints, such as those on BGA packages. Functional testing ensures circuits operate correctly before delivery.
Lead times for SMT PCB assembly vary depending on PCB complexity, volume, and component availability. For small prototypes, assembly can often be completed within a few days to a couple of weeks.
Standard production runs typically require four to six weeks, including component procurement, PCB preparation, assembly, and testing. Larger or high-density orders may take longer due to intricate component placement or special inspection requirements.
SMT assembly includes several layers of inspection and testing to ensure product quality. Automated Optical Inspection (AOI) checks for missing, misaligned, or incorrectly oriented components. X-ray inspection can be used for hidden solder joints, such as BGAs or fine-pitch ICs. Functional testing confirms that the assembled PCB operates correctly under normal conditions. Additional tests, such as in-circuit testing or environmental stress testing, can be applied for mission-critical applications.
SMT PCB assembly is used across a wide range of industries that demand compact, high-performance electronic devices. These include telecommunications, medical devices, automotive, aerospace, industrial automation, consumer electronics, and military applications.
Any sector requiring small, lightweight, high-density boards with reliable performance benefits from SMT. The technology supports advanced circuitry, fine-pitch ICs, and multi-layer boards, enabling faster, more efficient products.